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Journal of Mechanics and MEMS

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Journal of Mechanics and MEMS

3,000.00

P-ISSN:

0974-8407

E-ISSN:

Frequency:

Bi-annual

Edition:

2025

Language:

English

Subscription Agency:

National Press Associates

Note:

The Subscription price Includes all shipping charges.
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Journal Details

About the Publisher

Serials Publications Pvt. Ltd. is a full-service publishing house. We are a leading international publisher as well as distributor of our numerous publications. Our books and journals are among the leading international publications in their respective fields. We adhere to the highest international standards for quality, with authors and editorial members from across the globe. Serials Publications Pvt. Ltd. subscribes to an inclusive publications philosophy, which seeks to further education and learning through publications that serve the various educational needs of educators.

About the Journal

The Journal of Mechanics and MEMS (JMM) publishes as rapidly as possible manuscripts of high standard quality original research papers and survey articles through electronic submission and reviewing. It provides a fast communication platform among researchers in all mechanics and MEMS, with particular emphasis in the integration of theory and applications. It is intended that the journal should act as an interdisciplinary forum for mechanics and its applications. Innovative applications and material that brings together diverse areas of mechanics are particularly welcome. In order to cover as wide an audience as possible, all kind of original works are encouraged. All papers will be in peer-reviewed. Topics covered by the JMM include (but are not limited to): • General mechanics; • Solid mechanics; • Fluid mechanics; • Structural mechanics; • Fracture mechanics; • Dynamics and vibration; • Plasticity; • Aerodynamics; • Rock mechanics; • Mechanics of Materials; • Applied mechanics; • Biomechanics; • Micro-mechanics; • Nano-mechanics; • Computational mechanics; • Mechanics devices and chips; • MEMS and NENS: Theory, design, simulation, processing, assembly and packaging; • Multiscale and multi-physics modelling and simulation and high level comprehensive review articles

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